Reporter: Intel Corporation recently announced that it has made a major breakthrough in transistor development. The first 3-D transistor entered the production technology stage. Intel's new technology can reduce nearly half of the power consumption. In this case, it is said that in the vast mobile electronics consumer market, it can be tied with ARM, how do you evaluate?
Wu Xiongang: This statement will not bring changes to the competition in the consumer electronics/mobile product market.
The development of Finfet/3D transistor technology involves many companies in the industry, and this innovation is not unique to Intel. The industry will gradually adopt this technology in the next generation of products, and then the technology will be applied to SoC design.
The entire ARM ecosystem is very active on the 22nm node, and has begun to devote 20nm, and ARM is also actively developing IP for these nodes. We have introduced four 20/22nm test chips (two 22nm, two 20nm) on May 4, 2011. ARM and all major foundries have cooperated at 20nm/22nm. We have announced the cooperation with IBM and the cooperation will continue to 14nm. Similarly, ARM and TSMC have already announced their cooperation on IP development for 20nm.
In the area of consumer electronics/mobile products, the use of technology that is one generation behind server/desktop computers is not new. But more importantly, in the area of consumer electronics/mobile products, because of its market size and product price, it is more important to be able to provide an optimal combination of cost, performance, and power consumption. At the same time, the production capacity of the foundry is also very important.
This 3D process technology requires a tightly coupled design flow in the first few generations and is not suitable for highly integrated mobile system-on-chip designs. The highly integrated mobile system-on-chip design is currently driving innovation in the semiconductor industry.
Intel’s statement is consistent with their history of innovation in craftsmanship. ARM's innovation comes from our ecosystem, covering many aspects such as process, micro-architecture, and system-on-chip (SoC) design.
Reporter: What is the latest development of ARM in the field of cloud computing and servers?
Wu Xiongang: We do not have much information on this issue for the media.
